AOX755
Product no.: 1005068
Price
on demand plus VAT
Category
Packaging unit
Rods/Ingots/Sticks/Wires
Process allocation
all
Format
Lead Free Solder from Feinhutte Halsbrucke GmbH
Solder for Electronics Manufacturing
Designation: AOX 755 (SnCu0,7Ni0,05Ge microalloyed)
Deliverability: Rods / Ingots / Sticks / Wires
Areas of Application:
- Wave-, Selective-, and Handsoldering
- Hot-Air-Leveling
- Dip Tinning
- Transformers Manufacture
- Electronics Manufacturing
- Refrigeration Industry
- Electroplating
Advantages:
- uniform Microstructure
- good wetting Properties
- good setting Behavior
- low dross Formation and Cavitation
- suitable for almost all types of PCB´s
Chemical Characterisation:
(in percent %)
| Element | we guarantee: | |
| Tin (Sn) | Residual | |
| Silver (Ag) | <0,1 | |
| Lead (Pb) | <0,07 | |
| Copper (Cu) | 0,5-0,9 | |
| Nickel (Ni) | 0,05-0,07 | |
| Antimony (Sb) | <0,1 | |
| Bismuth (Bi) | <0,1 | |
| Aluminium (Al) | <0,001 | |
| Arsenic (As) | <0,03 | |
| Cadmium (Cd) | <0,002 | |
| Iron (Fe) | <0,02 | |
| Indium (In) | <0,1 | |
| Zinc (Zn) | <0,001 | |
| Gold (Au)Germanium (GE) | <0,050,005-0,009 |
Physikalische Eigenschaften:
| Melting Temperature [°C] | : | 227 (soldering wave temperature ca. 265 – 275 °C) |
| Density [g/cm³] | : | ~7,31 |
| Hardness [HV] | : | ~11,5 |
| Tensile Strength [N/mm²] | : | ~40,0 |
| Stretching [%] : | : | ~70,0 |
| therm. Expansion Coefficient [1/°C] | : | ~23,6 x 10-6 |