BiSn42
Product no.: 1005076
Price
on demand plus VAT
Category
Packaging unit
Rods/Ingots/Sticks/Wires
Process allocation
all
Format
Lead Free Solder from Feinhutte Halsbrucke GmbH
Solder for Electronics Manufacturing
Designation: Bi58Sn42 (ISO 9453 Alloy-No. 301)
Deliverability: Rods / Ingots / Sticks / Wires
Areas of Application:
- use as Smelting Securing/Fuses
- embedding Material for temperature-sensitive Components
- Rework and Soldering in general lowest brazing Temperatures
- secondary Soldering
- Electronics Manufacturing
- Dip Tinning
- Electroplating
Advantages:
- low melting Point
- uniform Microstructure
- good wetting Properties
- good setting Behavior
- low dross Formation and Cavitation
- good thermal and electrical Conductivity
Chemical Characterisation:
(in percent %)
| Element | ISO 9453 | |
| Tin (Sn) | 41,0-43,0 | |
| Silver (Ag) | <0,05 | |
| Lead (Pb) | <0,07 | |
| Copper (Cu) | <0,05 | |
| Nickel (Ni) | <0,01 | |
| Antimony (Sb) | <0,01 | |
| Bismuth (Bi) | Residual | |
| Aluminium (Al) | <0,001 | |
| Arsenic (As) | <0,03 | |
| Cadmium (Cd) | <0,002 | |
| Iron (Fe) | <0,02 | |
| Indium (In) | <0,1 | |
| Zinc (Zn) | <0,001 | |
| Gold (Au) | <0,05 |
Physical Properties:
| Melting Temperature | :139 |
| Density [g/cm3] | : ~8,7 |
| Hardness [HB] | : ~22,0 |
| Shear Strength [N/mm2] | : ~27,0 at 20 °C_1mm/min. |
| : ~15,6 at 100°C_1mm/min. | |