Sn99Cu1spezial
Product no.: 1005056
Price
on demand plus VAT
Category
Packaging unit
Rods/Ingots/Sticks/Wires
Process allocation
all
Format
Lead Free Solder from Feinhutte Halsbrucke GmbH
Solder for Electronics Manufacturing
Designation: Sn99,25Cu0,7Ni,05 (ISO 9453 Alloy-No. 403)
Deliverability: Rods / Ingots / Sticks / Wires
Areas of Application:
- Wave-, Selective-, and Handsoldering
- Hot-Air-Leveling
- Dip Tinning
- Transformers Manufacture
- Electronics Manufacturing
- Refrigeration Industry
- Electroplating
Advantages:
- uniform Microstructure
- good wetting Properties
- good setting Behavior
- low dross Formation and Cavitation
- suitable for almost all types of PCB´s
Chemical Characterisation:
(in percent %)
| Element | ISO 9453 |
| Tin (Sn) | Residual |
| Silver (Ag) | <0,1 |
| Lead (Pb) | <0,07 |
| Copper (Cu) | 0,5-0,9 |
| Nickel (Ni) | 0,02-0,08 |
| Antimony (Sb) | <0,1 |
| Bismuth (Bi) | <0,1 |
| Aluminium (Al) | <0,001 |
| Arsenic (As) | <0,03 |
| Cadmium (Cd) | <0,002 |
| Iron (Fe) | <0,02 |
| Indium (In) | <0,1 |
| Zinc (Zn) | <0,001 |
| Gold (Au) | <0,05 |
Physical Properties:
| Melting Temperature [°C] | : 227 (soldering wave temperature ca. ≥265 – 275 °C) |
| Density [g/cm3] | : ~7,3 |
| Shear Strength [N/mm²] | :~23,0 at 20 °C_1mm/min. |
| : ~16,0 at 100 °C_1mm/min. | |
| Creep Strength [N/mm²] | : ~8,6 at 20 °C_1mm/min |
| : ~2,1 at 100 °C_1mm/min. |