EO-B-006C/X (#6108)

Special Flux for wave-, selective-, hand-soldering
(WEEE/RoHS-compliant)
[OSP-compatible]
ISO-9454: 2231 (2.2.3.A) / DIN-EN 61190-1-1: (IEC:OR/L0)
“NO CLEAN”

Description

EO-B-006C/X is a flux of the latest generation. This is a universally suitable flux for wave-, selective- and hand-soldering of PCBs and complies with specification DIN-EN 61190-1-1: L0. Accordingly, it contains organic activation system with additives in a combination specially tuned to the thermal requirements of the soldering processes.
EO-B-006C/X can be applied by brushing, spraying, dipping, etc., IMPORTANT: Foamfluxing is not possible. The solids content is 4% by weight.
EO-B-006C/X is a NO-CLEAN flux and formulated without resin/rosin. It leaves no dark-colored and sticky residues and is totally free from corrosion action.

Instructions for use:
This flux is very versatile and OPS-compatible. There are good results for manual, wave
and selective soldering, as well as for cable assembly / wire tinning. The general rule of
applying fluxes applied in principle as low as possible also applies to this product.

Sprayfluxing: If possible, try at first a quantity of 10 – 30 ml/min. and observe the distribution of the flux. After that, correct the quantity. Air-pressure: 18 –20 l/min.
Preheating: Entering the solder-wave, the temperature on the topside of the pasteboards should be 80 – 110 °C, dependent on type of boards, lay-out etc. – in case of using lead-free solders, preheating temperatures of 100 –140 °C on the topsides are possible.

Packing units: Jerrycans with 5 and 20 litres, other packing sizes on request

Safety instructions: Please refer to the current MSDS

Technical specifications
Appearance: Colourless, transparent, liquid
Solid contents: 3,9 – 4,1%
Density (20° C): 0.796 (+/-0.003) g/ml
Acid-no.: 32 – 35 mg KOH/g
Activators: Activation system with additives,
resin/rosin-free
Halide-content: 0%
Solvents: short chain alcohols
Flash-point: 12 °C (cc)